EPOWOOL® inorganic board is a high temperature rigid product manufactured by a wet forming process using fiber bulk and binders. It offers low thermal conductivity and high temperature stability in application where vibration, mechanical stress and strong erosive forces are present. The excellent rigidity and modulus of rupture inherent to these boards makes them strong and self-supporting, yet relatively lightweight and easy to cut or machine.
Usually there would be black smoke and stink smell during first time board burning. Through formulation improvement based on current product, ENPRO inorganic board is developed to solve the phenomenon and realizes green application of ceramic fiber board.
Product category and index
1260 Inorganic Board | 1430 Inorganic Board | 1600 Inorganic Board | ||
Working Temperature | ℃ | 1000 | 1250 | 1450 |
Density | kg/m³ | 320 | 320 | 400 |
Heat Linear Shrinkage | % | ≤4(at 1260℃*24h) | ≤4(at 1430℃*24h) | ≤3(at 1600℃*24h) |
Thermal conductivity (GB/T17911.8) | W/mK | 0.13(at average 600℃) 0.17(at average 800℃) 0.25(at average 1000℃) | ||
Organic Ratio | % | No organics | ||
Dimension | mm | 1000*600*50/25 900*600*50/25 | ||
Packaging | - | Carton or Pallet |
* The data shown are the test results obtained under the standard process and may change.
* If you need to confirm whether the product meets your application requirements and other parameters, please consult the engineering department.
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